Conductive Heating

ABSTRACT

A storage device transporter is provided for transporting a storage device and for mounting a storage device within a test slot. The storage device transporter includes a frame that is configured to receive and support a storage device. The storage device transporter also includes a conductive heating assembly that is associated with the frame. The conductive heating assembly is arranged to heat a storage device supported by the frame by way of thermal conduction.

TECHNICAL FIELD

This disclosure relates to the heating of storage devices duringtesting.

BACKGROUND

Disk drive manufacturers typically test manufactured disk drives forcompliance with a collection of requirements. Test equipment andtechniques exist for testing large numbers of disk drives serially or inparallel. Manufacturers tend to test large numbers of disk drivessimultaneously in batches. Disk drive testing systems typically includeone or more racks having multiple test slots that receive disk drivesfor testing.

The testing environment immediately around the disk drive is closelyregulated. Minimum temperature fluctuations in the testing environmentare critical for accurate test conditions and for safety of the diskdrives. The latest generations of disk drives, which have highercapacities, faster rotational speeds and smaller head clearance, aremore sensitive to vibration. Excess vibration can affect the reliabilityof test results and the integrity of electrical connections. Under testconditions, the drives themselves can propagate vibrations throughsupporting structures or fixtures to adjacent units. This vibration“cross-talking,” together with external sources of vibration,contributes to bump errors, head slap and non-repetitive run-out (NRRO),which may result in lower test yields and increased manufacturing costs.

During the manufacture of disk drives or other storage devices, it iscommon to control the temperature of the storage devices, e.g., toensure that the storage devices are functional over a predeterminedtemperature range. For this reason, the testing environment immediatelyaround the storage devices is closely regulated. Minimum temperaturefluctuations in the testing environment can be critical for accuratetest conditions and for safety of the storage devices. In some knowntesting systems, the temperature of plural disk drive devices isadjusted by using cooling or heating air which is common to all of thedisk drive devices.

SUMMARY

In general, this disclosure relates to the heating of storage devicesduring testing.

In one aspect, a storage device transporter is provided for transportinga storage device and for mounting a storage device within a test slot.The storage device transporter includes a frame that is configured toreceive and support a storage device. The storage device transporteralso includes a conductive heating assembly that is associated with theframe. The conductive heating assembly is arranged to heat a storagedevice supported by the frame by way of thermal conduction.

In another aspect, a test slot assembly includes a storage devicetransporter and a test slot. The storage device transporter includes aframe that is configured to receive and support a storage device, and aconductive heating assembly. The conductive heating assembly isassociated with the frame and is arranged to heat a storage devicesupported by the frame by way of thermal conduction. The test slotincludes a test compartment for receiving and supporting the storagedevice transporter.

In a further aspect, a storage device testing system includes a storagedevice transporter, a test slot, and test electronics. The storagedevice transporter includes a frame configured to receive and support astorage device, and a conductive heating assembly. The conductiveheating assembly is associated with the frame and is arranged to heat astorage device supported by the frame by way of thermal conduction. Thetest slot includes a test compartment for receiving and supporting thestorage device transporter, and a connection interface board. The testelectronics are configured to communicate one or more test routines to astorage device disposed within the test compartment. The connectioninterface board is configured to provide electrical communicationbetween the conductive heating assembly and the test electronics whenthe storage device transporter is disposed within the test compartment.

According to another aspect, a method includes testing functionality ofa storage device; and heating the storage device via thermal conductionduring the testing.

Embodiments of the disclosed methods, systems and devices may includeone or more of the following features.

In some embodiments, a clamping mechanism is operatively associated withthe frame. The clamping mechanism is operable to move the conductiveheating assembly into contact with a storage device supported by theframe. The clamping mechanism can be configured to clamp the storagedevice transporter within the test compartment of the test slot.

In some cases, the conductive heating assembly can include one or moreelectric heating elements (e.g., resistive heaters). In someembodiments, the conductive heating assembly can include printedcircuitry (e.g., a printed wiring board, flexible printed circuitry,etc.). The printed circuitry can include one or more electricallyconductive layers. The one or more electric heating elements can beintegrated in the one or more electrically conductive layers.

The storage device transporter can also include a temperature sensor(e.g., a thermocouple). The temperature sensor can be arranged tocontact a storage device supported by the frame for measuring atemperature of the storage device. In some examples, a clampingmechanism is operatively associated with the frame. The clampingmechanism is operable to move the conductive heating assembly and thetemperature sensor into contact with a storage device supported by theframe.

In some cases the conductive heating assembly can include one or moreelectric heating elements (e.g., resistive heaters) and contactterminals in electrical communication with the one or more electricheating elements, and the test slot can include a connection interfacecircuit and electrically conductive contacts (e.g., spring contacts,pogo pins, etc.) in electrical communication with the connectioninterface circuit. The electrically conductive contacts can be arrangedto engage the contact terminals of the conductive heating assembly whenthe storage device transporter is disposed within the test compartment.

In some embodiments, the conductive heating assembly can include one ormore electric heating elements (e.g., resistive heaters) and a firstblind mate connector in electrical communication with the one or moreelectric heating elements, and the test slot can include a connectioninterface circuit and a second blind mate connector in electricalcommunication with the connection interface circuit. The second blindmate connector can be arranged to engage the first blind mate connectorwhen the storage device transporter is disposed within the testcompartment.

The test electronics can be configured to control a current flow to theconductive heating assembly. In some embodiments, the storage devicetransporter include a temperature sensor (e.g., a thermocouple) and theconnection interface board is configured to provide electricalcommunication between a temperature sensor and the test electronics whenthe storage device transporter is disposed within the test compartment,and the test electronics are configured to control a current flow to theconductive heating assembly based, at least in part, on signals receivedfrom the temperature sensor. Alternatively or additionally, a separatetemperature sensor could be provided on the connection interface boardthat could serve as the control point. It is also possible to have atemperature sensing device that is attached to a ground line thatconnects to the storage device that correlates to the temperature of thestorage device.

Methods can include heating the storage device with a resistive heater.Methods can also include contacting the storage device with theresistive heater. In some cases, contacting the storage device with theresistive heater can include actuating a clamping mechanism to move theresistive heater into contact with the storage device.

Methods can also include inserting a storage device transporter,supporting a storage device, into a test slot. Heating the storagedevice can include heating the storage device by way of thermalconduction while the storage device transporter and the supportedstorage device are disposed within the test slot.

Embodiments can include one or more of the following advantages.

Conductive heating can be provided between a storage device transporterand a storage device supported therein. Conductive heating can be moreefficient than known convective heating methods, and thus, can help toreduce energy consumption.

Conductive heating can be executed without, or with limited/reduced useof, moving parts, such as blowers or fans which are often employed forconvective heating, and thus, can help to limit the generation ofvibrations.

DESCRIPTION OF DRAWINGS

FIG. 1 is a is a perspective view of a storage device testing system.

FIG. 2 is a perspective view of a test slot assembly.

FIGS. 3A and 3B are schematic views of self-test and functional testcircuitry.

FIG. 4 is a perspective view of a transfer station.

FIG. 5 is a perspective view of a tote and storage device.

FIG. 6A is a top view of a storage device testing system.

FIG. 6B is a perspective view of a storage device testing system.

FIG. 7 is an exploded perspective view of a storage device transporter.

FIG. 8 is a perspective view of a clamping mechanism.

FIGS. 9A and 9B are perspective views of a spring clamp.

FIG. 10 is a perspective view of a pair of actuators.

FIGS. 11A and 11B are perspective views of a storage device transporterframe.

FIG. 12 is a perspective view of a conductive heating assembly.

FIG. 13 is a plan view of a pair of printed wiring boards from theconductive heating assembly of FIG. 12.

FIG. 14 is a perspective view of a pair of spring plates.

FIG. 15A is side view of a storage device transporter.

FIG. 15B is a cross-sectional view of the storage device transporter ofFIG. 15A taken along line 15B-15B.

FIG. 15C is a detailed view from FIG. 15B.

FIG. 15B is a cross-sectional view of the storage device transporter ofFIG. 15A taken along line 15D-15D.

FIG. 16A is a sectioned plan view a storage device transporter withspring clamps in an engaged position.

FIG. 16B is a detailed view from FIG. 16A.

FIG. 16C is a sectioned front view a storage device transporter with aconductive heating assembly in an engaged position.

FIGS. 17A and 17B are perspective and plan views of a storage devicetransporter supporting a storage device.

FIG. 18 is a plan view of a storage device transported clamped to astorage device.

FIG. 19 is a perspective view of a test slot.

FIG. 20 is a perspective view of a connection interface board.

FIG. 21 is a perspective view of a test compartment from the test slotof FIG. 19 (with the front cover removed).

FIG. 22A is a plan view showing a storage device transporter, supportinga storage device, inserted in a test slot.

FIG. 22B is a detailed view from FIG. 22A.

FIG. 23 is a plan view of a flexible printed circuit with integratedresistive heaters.

FIG. 24 is a perspective view of a conductive heating assembly with theflexible printed circuit of FIG. 23.

FIG. 25 is a perspective view of a conductive heating assembly with theflexible printed circuit of FIG. 23 mounted to a transporter frame(shown in hidden lines).

FIG. 26 is a perspective view of a storage device transporter,supporting a storage device, aligned for connection with a deviceinterface board.

FIG. 27 is a perspective view of a storage device transporter,supporting a storage device, aligned for connection (via blind matingconnectors) with a device interface board.

FIG. 28 is a plan view of a pair of printed wiring boards withintegrated resistive heaters and thermocouples.

FIG. 29 is a perspective view of a temperature sensing assembly with acompliant material on exposed surfaces of printed wiring boards.

Like reference symbols in the various drawings indicate like elements.

DETAILED DESCRIPTION System Overview

As shown in FIG. 1, a storage device testing system 10 includes aplurality of test racks 100 (e.g., 10 test racks shown), a loadingstation 200, and a robot 300. Each test rack 100 holds a plurality oftest slot assemblies 120. As shown in FIG. 2, each test slot assembly120 includes a storage device transporter 400 and a test slot 500. Thestorage device transporter 400 is used for capturing storage devices 600(FIG. 5) (e.g., from the loading station) and for transporting thestorage devices 600 to one of the test slots 500 for testing.

A storage device, as used herein, includes disk drives, solid statedrives, memory devices, and any device that requires asynchronoustesting for validation. A disk drive is generally a non-volatile storagedevice which stores digitally encoded data on rapidly rotating platterswith magnetic surfaces. A solid-state drive (SSD) is a data storagedevice that uses solid-state memory to store persistent data. An SSDusing SRAM or DRAM (instead of flash memory) is often called aRAM-drive. The term solid-state generally distinguishes solid-stateelectronics from electromechanical devices.

Referring to FIG. 3A, in some implementations, the storage devicetesting system 10 also includes at least one computer 130 incommunication with the test slots 500. The computer 130 may beconfigured to provide inventory control of the storage devices 600and/or an automation interface to control the storage device testingsystem 10. Within each of the test racks 100, test electronics 160 arein communication with each test slot 500. The test electronics 160 areconfigured to communicate with a disk dive 600 received within the testslot 500. The test electronics 160 execute test algorithms and monitorthe status (e.g., temperature) of storage devices under test.

Referring to FIG. 3B, a power system 170 supplies power to the storagedevice testing system 10. The power system 170 may monitor and/orregulate power to the received storage device 600 in the test slot 500.In the example illustrated in FIG. 3B, the test electronics 160 withineach test rack 100 include at least one self-testing system 180 incommunication with at least one test slot 500. The self-testing system180 tests whether the test rack 100 and/or specific sub-systems, such asthe test slot 500, are functioning properly. The self-testing system 180includes a cluster controller 181, one or more connection interfacecircuits 182 each in electrical communication with a storage device (SD)600 received within the test slot 500, and one or more block interfacecircuits 183 in electrical communication with the connection interfacecircuit 182. The cluster controller 181, in some examples, is configuredto run one or more testing programs with a capacity of approximately 120self-tests and/or 60 functionality test of storage devices 600. Theconnection interface circuits 182 and the block interface circuit(s) 183are configured to self-test. However, the self-testing system 180 mayinclude a self-test circuit 184 configured to execute and control aself-testing routine on one or more components of the storage devicetesting system 10. The cluster controller 181 may communicate with theself-test circuit 184 via Ethernet (e.g. Gigabit Ethernet), which maycommunicate with the block interface circuit(s) 183 and onto theconnection interface circuit(s) 182 and storage device(s) 600 viauniversal asynchronous receiver/transmitter (UART) serial links. A UARTis usually an individual (or part of an) integrated circuit used forserial communications over a computer or peripheral device serial port.The block interface circuit(s) 183 is/are configured to control power toand temperature of the test slots 500, and each block interface circuit183 may control one or more test slots 500 and/or storage devices 600.

In some examples, the test electronics 160 can also include at least onefunctional testing system 190 in communication with at least one testslot 500. The functional testing system 190 tests whether a receivedstorage device 600, held and/or supported in the test slot 500 by thestorage device transporter 400, is functioning properly. A functionalitytest may include testing the amount of power received by the storagedevice 600, the operating temperature, the ability to read and writedata, and the ability to read and write data at different temperatures(e.g. read while hot and write while cold, or vice versa). Thefunctionality test may test every memory sector of the storage device600 or only random samplings. The functionality test may test anoperating temperature of the storage device 600 and also the dataintegrity of communications with the storage device 600. The functionaltesting system 190 includes a cluster controller 181 and at least onefunctional interface circuit 191 in electrical communication with thecluster controller 181. A connection interface circuit 182 is inelectrical communication with a storage device 600 received within thetest slot 500 and the functional interface circuit 191. The functionalinterface circuit 191 is configured to communicate a functional testroutine to the storage device 600. The functional testing system 190 mayinclude a communication switch 192 (e.g. Gigabit Ethernet) to provideelectrical communication between the cluster controller 181 and the oneor more functional interface circuits 191. Preferably, the computer 130,communication switch 192, cluster controller 181, and functionalinterface circuit 191 communicate on an Ethernet network. However, otherforms of communication may be used. The functional interface circuit 191may communicate to the connection interface circuit 182 via Parallel ATAttachment (a hard disk interface also known as IDE, ATA, ATAPI, UDMAand PATA), SATA, or SAS (Serial Attached SCSI).

Referring to FIG. 4, in some implementations, the transfer station 200includes a transfer station housing 210 and multiple tote presentationsupport systems 220 disposed on the transfer station housing 210. Eachtote presentation support system 220 is configured to receive andsupport a storage device tote 260 in a presentation position forservicing by the storage device testing system 10.

The tote presentation support systems 220 are each disposed on the sameside of the transfer station housing 210 and arranged vertically withrespect to each other. Each tote presentation support system 220 has adifferent elevation with respect to the others. In some examples, asshown in FIG. 4, the tote presentation support system 220 includes totesupport arms 226 configured to be received by respective arm grooves 266(FIG. 5) defined by the storage device tote 260.

A tote mover 230 is disposed on the transfer station housing 210 and isconfigured to move relative thereto. The tote mover 230 is configured totransfer the totes 260 between the tote presentation support systems 220for servicing by the storage device testing system 10 (e.g. by the robot300 (FIG. 1)) and a staging area 250 where the totes 260 can be loadedinto and unloaded from the transfer station 200 (e.g., by an operator).

As illustrated in FIG. 5, the totes 260 include a tote body 262 whichdefines multiple storage device receptacles 264 (e.g., 18 shown) thatare each configured to house a storage device 600. Each of the storagedevice receptacles 264 includes a storage device support 265 configuredto support a central portion of a received storage device 600 to allowmanipulation of the storage device 600 along non-central portions (e.g.,along side, front and/or back edges of the storage device). The totebody 262 also defines arm grooves 266 that are configured to engage thetote support arms 226 (FIG. 4) of the transfer station housing 210thereby to support the tote 260 (e.g., for servicing by the robot 300(FIG. 1)).

Referring to FIGS. 6A and 6B, the robot 300 includes a robotic arm 310and a manipulator 312 (FIG. 6A) disposed at a distal end of the roboticarm 310. The robotic arm 310 defines a first axis 314 (FIG. 6B) normalto a floor surface 316 and is operable to rotate through a predeterminedarc about and extends radially from the first axis 314 within a robotoperating area 318. The robotic arm 310 is configured to independentlyservice each test slot 500 by transferring storage devices 600 betweenthe totes 260 at the transfer station 200 and the test racks 100. Inparticular, the robotic arm 310 is configured to remove a storage devicetransporter 400 from one of the test slots 500 with the manipulator 312,then pick up a storage device 600 from one the storage devicereceptacles 264 at the transfer station 200 with the storage devicetransporter 400, and then return the storage device transporter 400,with a storage device 600 therein, to the test slot 500 for testing ofthe storage device 600. After testing, the robotic arm 310 retrieves thestorage device transporter 400, along with the supported storage device600, from one of the test slots 500 and returns it to one of the storagedevice receptacles 264 at the transfer station 200 (or moves it toanother one of the test slots 500) by manipulation of the storage devicetransporter 400 (i.e., with the manipulator 312).

Storage Device Transporter

As shown in FIG. 7, the storage device transporter 400 includes a frame410, a clamping mechanism 450, and a conductive heating assembly 490.The conductive heating assembly allows a storage device supported by theframe to be heated by way of thermal conduction.

As shown in FIG. 8, the clamping mechanism 450 includes a pair ofclamping assemblies 452 each including an actuator 454 and a pair ofspring clamps (i.e., proximal and distal spring clamps 456 a, 456 b).Referring to FIGS. 9A and 9B, the spring clamps 456 a, 456 b include abase portion 458 and first and second spring arms 460 a, 460 b eachhaving a proximal end 462 connected to the base portion 458 and adisplaceable distal end 464. The spring clamps 456 a, 456 b can beformed from sheet metal, e.g., stainless steel. Between their proximaland distal ends 462, 464 the spring arms 460 a, 460 b define a narrowregion 466, a broad region 468 and a pair of edges 470 therebetween. Asillustrated in FIG. 9A, the first spring arm 460 a includes a firstengagement member 472 having a damper 474. The damper 474 can be formedfrom, e.g., thermoplastics, thermosets, etc. As shown in FIG. 9B, thesecond spring arm 460 b includes a second engagement member 476 whichdefines a protuberance 478. Each of the spring clamps 456 a, 456 b alsoincludes a pair of mounting tabs 480 that extends outwardly from thebase portion 458. Following assembly with the frame 410, the mountingtabs 480 help to keep the spring clamps 456 a, 456 b in position withinsidewalls 418 (FIGS. 11A and 11B) of the frame 410. Following assembly,the spring clamps 456 a, 456 b are mounted to the frame 410 and areoperatively associated with the actuators 454 (e.g., for clamping astorage device 600 within the frame and/or for clamping the frame withinone of the test slots 500).

Referring to FIG. 10, each of the actuators 454 includes inner and outersurfaces 481 a, 481 b which define actuating features. The actuatingfeatures include wedges 482 and recesses 483. The actuators 454 alsodefine openings 484 which extend between the inner and outer surfaces481 a, 481 b. At their proximal ends 485, the actuators 454 includeactuator sockets 486 which are configured to be engageable with themanipulator 312 (FIG. 6A) for controlling movement of the actuators 454relative to the frame 410.

As illustrated in FIGS. 11A and 11B, the frame 410 includes a face plate412. Along a first surface 414, the face plate 412 defines anindentation 416. The indentation 416 can be releaseably engaged by themanipulator 312 (FIG. 6A) of the robotic arm 310, which allows therobotic arm 310 to grab and move the storage device transporter 400. Theface plate 412 also includes beveled edges 417 (FIG. 11B). When thestorage device transporter 400 is inserted into one of the test slots500, the beveled edges 417 of the face plate 412 abut complimentarybeveled edges 515 (FIG. 19) of the test slot 500 to form a seal, which,as described below, helps to inhibit the flow of air into and out of thetest slot 500.

The frame 410 also includes a pair of sidewalls 418, which extendoutwardly from a second surface 420 of the face plate 412, and a baseplate 422 that extends between and connects the sidewalls 418. Thesidewalls 418 and the base plate 422 together define a substantiallyU-shaped opening, which allows the storage device transporter 400 to beused to capture a storage device 600 off of the storage device supports226 in the totes 220.

The frame 410 also includes a plenum wall 401 that is disposed between astorage device region 402 a and a plenum region 402 b. An air flow(e.g., for cooling a storage device supported in the transporter 400)can be directed into the plenum region 402 b via an inlet aperture 403in one of the sidewalls 418. The air flow can then be delivered towardsthe storage device region 402 a through an air flow aperture 404 in theplenum wall 401. The frame 410 can be formed of molded plastic.

A weight 405 (e.g., a copper block) is disposed within the plenum region402 b and is mounted to the base plate 422. The weight 405 can help toinhibit the transmission of vibration between a supported storage deviceand the test slot 500 during testing.

The sidewalls 418 are spaced to receive a storage device 600 (FIG. 5)therebetween, and define surfaces 424 for supporting the storage device600. The sidewalls 418 also define back hooks 426, which can be usefulfor extracting the storage device 600 from a test slot 500 (e.g., forseparating a connector on the storage device from a mating connector inthe test slot 500). The back hooks 426 include openings 427, which canhelp to accommodate the conductive heating assembly 490. The sidewalls418 also define lead-ins 428 (e.g., chamfered edges), which can aid incentering a storage device 600 in the frame 410.

The sidewalls 418 each define a pair of pass-through apertures 430,which extend between inner and outer surfaces 432 a, 432 b of thesidewalls 418. Following assembly, a corresponding one of the springclamps 456 a, 456 b is associated with each of the pass-throughapertures 430. The sidewalls 418 also define actuator slots 434 whichextend from a proximal end 435 to a distal end 436 of each sidewall 418.The face plate 412 defines a pair of apertures 437 (FIG. 11A) whichextend between the first and second surfaces 414, 420 thereof, and whichallow access to the actuator slots 434. When assembled, the actuators454 (FIG. 8) are slidably disposed within the actuator slots 434 and arearranged to actuate movements of the spring arms 456 a, 456 b.

Referring still to FIGS. 11A and 11B, the sidewalls 418 also definethrough-holes 438. The through-holes 438 extend between the inner andouter surfaces 432 a, 432 b of the sidewalls 418 and allow for access tothe actuator slots 434 in the regions between the pass-through apertures430. The conductive heating assembly can be mounted to the frame 410 viathese through holes 438.

As shown in FIG. 12, the conductive heating assembly 490 includes a pairof printed wiring boards (i.e., first and second printed wiring boards491 a, 491 b), a pair of pressure plates 492, and a pair of resilientbiasing mechanisms (shown in the form of spring plates 493), whichoperate to bias the printed wiring boards 491 a, 491 b toward thesidewalls 418 of the frame 410 following assembly. Referring to FIG. 13,each of the printed wiring boards 491 a, 491 b includes a resistiveheater 487 integrated (e.g., etched) in an electrically conductive(e.g., copper) layer at respective first surfaces 488 of the printedwiring boards 491 a, 491 b. The printed wiring boards 491 a, 491 binclude wiring pads 489 at their respective proximal ends 494 a. Theprinted wiring boards 491 a, 491 b can be electrically connected to eachother via wires 495 which are soldered to the printed wiring boards 491a, 491 b at the wiring pads 489. The first printed wiring board 491 aincludes a pair of contact terminals 496 at its distal end 494 b. Thecontact terminals 496 allow for electrical communication with aconnection interface board 520 within the test slot 500. The printedwiring boards 491 a, 491 b can be formed from an FR 4 substrate with andetched copper surface layer. Each of the printed wiring boards 491 a,491 b is mounted (e.g., via adhesive or mechanical fasteners) to anassociated one of the pressure plates 492.

The pressure plates 492 are substantially flat and can be formed ofmetal or rigid plastic. The pressure plates 492 are each mounted to acorresponding one of the spring plates 493.

Referring to FIG. 14, the spring plates 493 each include a body member497 and upper and lower edges 498 a, 498 b extending outwardly fromopposing sides of the body member 497. The body member 497 is attachedto one of the pressure plates 492 (e.g., via adhesive or mechanicalfasteners). The spring plates 493 can be formed from sheet metal, e.g.,stainless steel. When assembled with the frame 410, the upper and loweredges 498 a, 498 b of the spring plates 493 rest within the actuatorslots 434 and the body members 497 extend through the through-holes 438in the sidewalls 418 towards the U-shaped opening in the frame 410.

Referring to FIG. 15A, following assembly of the conductive heatingassembly 490 and the clamping mechanism with the frame 410, theactuators 454 are each independently slidable within a corresponding oneof the actuator slots 434 (FIG. 11A) and are moveable relative to thesidewalls 418 between a released and an engaged position. As illustratedin FIGS. 15B-15C, when the actuators 454 are in the released position,the engagement members 472, 476 are biased towards a rest position inwhich they are retracted within the recesses 483 (FIG. 15C) of theactuators 454. As illustrated in FIG. 15D, with the engagement members472, 476 in the rest position, the spring plates 493 force (bias) thepressure plates 492 to rest against the sidewalls 418, as illustrated inFIG. 15D.

The first and second engagement members 472, 476 of the spring clamps456 a, 456 b can also be engaged by pushing the actuators 454 inwardlytoward the first surface 414 of the face plate 414 (as indicated byarrow 60 in FIG. 16A). Referring to FIGS. 16A-16B, in the engagedposition, the wedges 482 of the actuators 454 engage the spring clamps456 a, 456 b to cause the first and second engagement members 472, 476of the spring arms 460 a, 460 b to extend outwardly from the inner andouter surfaces 432 a, 432 b of the sidewalls 418. As shown in FIGS. 16Band 16C, in the engaged position, the dampers 474 (FIG. 16B) engage thepressure plates 492, thereby forcing the pressure plates 492, and theattached printed circuit boards 491 a, 491 b, away from the sidewalls418.

As shown in FIGS. 17A and 17B, when the actuators 454 are in the releaseposition, with the spring clamps 456 a, 456 b and pressure plates 492refracted, a storage device 600 (shown hidden in FIG. 17B) can beinserted into the frame 410 between the printed wiring boards 491 a, 491b. With a storage device 600 inserted in the frame 410, the actuators454 can be moved towards the engaged position to displace the firstengagement members 472 into contact with the pressure plates 492,thereby causing displacement of the pressure plates 492 and the attachedprinted wiring boards 491 a, 491 b, such that the printed wiring boardsengage the storage device 600. This provides for direct contact of theprinted wiring boards 491 a, 491 b with the storage device 600 for goodconductive heat transfer between the resistive heaters 487 and thestorage device 600, and, at the same time, clamps the storage device 600against movement relative to the frame 410, as shown in FIG. 18. Thedampers 474 can help to inhibit the transfer of vibrations betweenstorage device transporter 400 and the storage device 600. It is alsopossible to add a compliant interface material between the heaterelement and the storage device to accommodate the surface irregularitiesof the storage device.

Test Slot

As shown in FIG. 19, the test slot 500 includes a base 510, upstandingwalls 512 a, 512 b and first and second covers 514 a, 514 b. The firstcover 514 a is integrally molded with the base 510 and the upstandingwalls 512 a, 512 b. The test slot 500 includes a rear portion 518 and afront portion 519. The rear portion 518 houses a connection interfaceboard 520, which carries the connection interface circuit 182 (FIGS. 3Aand 3B). As shown in FIG. 20, the connection interface board 520includes electrical connectors 522 disposed along a distal end 573 ofthe connection interface board 520. The electrical connectors 522provide for electrical communication between the connection interfacecircuit 182 (FIGS. 3A and 3B) and the test circuitry (e.g., self testsystem 180 and/or functional test system 190) in the associated testrack 100. The connection interface board 520 also includes a test slotconnector 524, which provides for electrical communication between theconnection interface circuit 182 and a storage device in the test slot500.

The connection interface board 520 also includes spring contacts 529.The spring contacts 529 are arranged to engage the contact terminals 496on the first printed wiring board 491 a when the storage devicetransporter 400 is inserted in the test slot 500, thereby providingelectrical communication between the printed wiring boards 491 a, 491 band the connection interface board 520. Pogo pins can also be used as analternative to, or in combination with, the spring contacts 529.Alternatively or additionally, mating (i.e., male and female) blind mateconnectors can be utilized to provide electrical communication betweenthe printed wiring boards 491 a, 491 b and the connection interfaceboard 520.

The front portion 519 of the test slot 500 defines a test compartment526 for receiving and supporting one of the storage device transporters400. The base 510, upstanding walls 512 a, 512 b, and the first cover514 a together define a first open end 525, which provides access to thetest compartment 526 (e.g., for inserting and removing the storagedevice transporter 400), and the beveled edges 515, which abut the faceplate 412 of a storage device transporter 400 inserted in the test slot500 to provide a seal that inhibits the flow of air into and out of thetest slot 500 via the first open end 525.

As shown in FIG. 21, in the region of the test compartment 526, theupstanding walls 512 a, 512 b define engagement features 527, whichprovide mating surfaces for the spring clamps 456 a, 456 b of thestorage device transporter 400 allowing the storage device transporter400 to be clamped within the test slot 500. For example, with a storagedevice 600 in the storage device transporter 400 and with the actuators454 in the release position, the storage device transporter 400 can beinserted into a test slot 500 until a connector 610 (FIG. 17A) on thestorage device 600 mates with the test slot connector 524.

With the storage device transporter 400 in a fully inserted positionwithin the test slot 500 (i.e., with the storage device connector 610mated with the test slot connector 524), the actuators 454 can be movedtowards the engaged position to displace the first and second engagementmembers 472, 476 of the spring clamps 456 a, 456 b to extend outwardlyfrom the inner and outer surfaces 432 a, 432 b of the sidewalls 418.Referring to FIGS. 22A and 22B, in the engaged position, the secondengagement members 476 extend outwardly from the outer surfaces 432 b ofsidewalls 418 and engage the engagement features 527 in the test slot500 to clamp the storage device transporter 400 against movementrelative to the test slot 500. At the same time, the first engagementmembers 472 extend outwardly from the inner surfaces 432 a of thesidewalls 418 and displace the printed wiring boards 491 a, 491 b of theconductive heating assembly 490 towards the storage device 600 to clampthe storage device 600 against movement relative to the storage devicetransporter 400 and to provide good thermal contact between the printedwiring boards 491 a, 491 b and the storage device 600. This good thermalcontact allows for efficient, conductive heating of the storage device600 via the resistive heaters 487 during testing. This clamping effectalso brings the contact terminals 496 of the first printed wiring board491 a into firm contact with the spring contacts 529 on the connectioninterface board 520.

Methods of Operation

In use, the robotic arm 310 removes a storage device transporter 400from one of the test slots 500 with the manipulator 312, then picks up astorage device 600 from one the storage device receptacles 264 at thetransfer station 200 with the storage device transporter 400, and thenreturns the storage device transporter 400, with a storage device 600therein, to the associated test slot 500 for testing of the storagedevice 600. During testing, the test electronics 160 execute a testalgorithm that includes, inter alia, adjusting the temperature of thestorage device 600 under test. For example, during testing the storagedevices 600 are each heated to a temperature of about 70° C. The testelectronics 160 can adjust the heating of the storage device 600 undertest by controlling the flow of electrical current to the resistiveheaters 487 of the conductive heating assembly 490. Thus, highlyefficient conductive heating of the storage device 600 can be achievedusing primarily only passive components (e.g., the resistive heaters487).

After testing, the robotic arm 310 retrieves the storage devicetransporter 400, along with the supported storage device 600, from thetest slot 500 and returns it to one of the storage device receptacles224 at the transfer station 200 (or moves it to another one of the testslots 500) by manipulation of the storage device transporter 400 (i.e.,with the manipulator 312).

Other Embodiments

Other embodiments are within the scope of the following claims.

For example, although an embodiment of a conductive heating assembly hasbeen described in which resistive heaters are integrated into thecircuitry on a pair of relatively rigid printed wiring boards that arehard wired together, in some embodiments, the resistive heaters can beintegrated into the circuitry of a flexible printed circuit. As anexample, FIG. 23 illustrates a flexible printed circuit 700 thatincludes a pair of circuit portions (i.e., first and second circuitportions 702 a, 702 b) and a connecting portion 704 that is integralwith the first and second circuit portions 702 a, 702 b.

Each of the first and second circuit portions 702 a, 702 b includes aresistive heater 706 that is defined by electrically conductive traces.The connecting portion 704 also includes electrically conductive traces708 which provide an electrical connection between the resistive heaters706 of the first and second circuit portions 702 a, 702 b. The firstcircuit portion 702 a includes a pair of contact terminals 710 at itsdistal end 712. The contact terminals 710 allow for electricalcommunication with the connection interface board 520 in the test slot500. Suitable flexible printed circuits with integrated resistiveheating are available from Watlow Electric Manufacturing Company ofColumbia, Mo.

As shown in FIG. 24, each of the first and second circuit portions 702a, 702 b is mounted (e.g., via adhesive or mechanical fasteners) to anassociated one of the pressure plates 492. The pressure plates 492 canextend along the entire back surfaces of the first and second circuitportions 702 a, 702 b for added stiffness and stability, e.g., to helpprovide good electrical connection between the contact terminals 710 onthe flexible printed circuit 700 and the spring contacts 529 (FIG. 20)on the connection interface board 520 when the storage devicetransporter 400 is inserted into the test slot 500.

Alternatively, as illustrated in FIG. 25, distal ends 712 of the firstand second circuit portions 702 a, 702 b can be left unsupported by thepressure plates 492 to allow the distal ends 712 to be wrapped aroundand conform to the shape of the back hooks 426 of the frame 410. Thedistal ends 712 of the first and second circuit portions 702 a, 702 bcan be attached to the back hooks 426, e.g., with adhesive. Asillustrated in FIG. 26, the connection interface board 520 can, in someembodiments, include pogo pins 530 for electrical contact with thecontact terminals 710 of the flexible printed circuit 700.

Alternative or additionally, electrical connection between the printedcircuitry of the storage device transporter and the connection interfaceboard can be provided by way of blind mate connectors. For example, FIG.27 illustrates an embodiment in which mating blind mate connectors(i.e., male blind mate connector 720 and female blind mate connector722) are provided for electrical communication between the printedcircuitry 700 of the storage device transporter 400 and the connectioninterface board 520.

In some embodiments, the conductive heating assembly 490 can alsoinclude one or more temperature sensors for monitoring the temperatureof a storage device supported in the storage device transporter duringtesting. For example, FIG. 28 illustrates one embodiment in which theprinted wiring boards 491 a, 491 b include a thermocouple 720 that isarranged to measure the temperature of a storage device supported in thestorage device transporter. In particular, when the printed wiringboards 491 a, 491 b are clamped against a storage device 600 supportedin the storage device transporter 400 , the thermocouple 720 contacts asurface of the storage device 600, thereby allowing a temperature of thestorage device 600 to be measured.

In addition to contact terminals 496 for the resistive heaters 487, thefirst printed wiring board 491 a is also provided with thermocouplecontact terminals 722 that are electrically connected to thethermocouple 720. Additional spring contacts or pogo pins can also beprovided on the connection interface board 520 (FIG. 20) to provideelectrical communication between the connection interface board 520 andthe thermocouple 720.

The thermocouple 720 can be placed in electrical communication with thetest electronics 160 (FIGS. 3A and 3B) via the connection interfaceboard 520. The test electronics 160 can be configured to control flowsof electrical current to the resistive heaters 487 based, at least inpart, on signals received from the thermocouple 720.

The thermocouple 720 can be provided in the form of a discrete devicethat is mounted to one of the printed wiring boards 491 a, 491 b or itcan be integrated into the electrically conductive layers of the printedwiring boards 491 a, 491 b. Furthermore, although an embodiment has beendescribed in which a thermocouple is provided on a rigid printed wiringboard, a thermocouple can also be incorporated in embodiments employingflexible printed circuits, such as the embodiment described above withregard to FIGS. 24-26. Flexible printed circuits with integratedthermocouples and/or resistive heaters are available from WatlowElectric Manufacturing Company of Columbia, Mo.

In some embodiments, the conductive heating assembly 490 can alsoinclude a compliant material, such as Sil-Pad manufactured by BergquistCompany of Chanhassen, Minn., as an additional layer between theresistive heaters 487 and a storage device supported in the storagedevice transporter 400. For example, FIG. 29 illustrates an embodimentin which a layer of compliant material 730 is adhered the first surfaces488 of the printed wiring boards 491 a, 491 b. The compliant material730 can help to inhibit scratching of a supported storage device whenclamped within the storage device transporter 400. The compliantmaterial 730 can also help to further inhibit the transmission ofvibrations between the storage device transporter 400 and a supportedstorage device. The compliant material between the resistive heaters andthe storage device also accommodates the surface irregularities of thestorage device and allows for more efficient heat transfer.

Although an embodiment of a storage device transporter has beendescribed which utilizes a pair of spring plates to bias the pressureplates, and the attached printed circuitry, toward respective sidewallsof the transporter frame, other resilient biasing mechanisms arepossible.

Although an embodiment of a clamping mechanism has been described thatincludes multiple spring claims, in some embodiments, as few as onespring clamp may be used.

Other embodiments are within the scope of the following claims.

1. A storage device transporter for transporting a storage device andfor mounting a storage device within a test slot, the storage devicetransporter comprising: a frame configured to receive and support astorage device; and a conductive heating assembly associated with theframe, wherein the conductive heating assembly is arranged to heat astorage device supported by the frame by way of thermal conduction. 2.The storage device transporter of claim 1, further comprising: aclamping mechanism operatively associated with the frame, wherein theclamping mechanism is operable to move the conductive heating assemblyinto contact with a storage device supported by the frame.
 3. Thestorage device transporter of claim 1, wherein the conductive heatingassembly comprises one or more electric heating elements.
 4. The storagedevice transporter of claim 3, wherein the one or more electric heatingelements comprise one or more resistive heaters.
 5. The storage devicetransporter of claim 1, wherein the conductive heating assemblycomprises printed circuitry, wherein the printed circuitry comprises oneor more electrically conductive layers, and wherein the one or moreelectric heating elements are integrated in the one or more electricallyconductive layers.
 6. The storage device transporter of claim 5, whereinthe printed circuitry comprises a printed wiring board.
 7. The storagedevice transporter of claim 5, wherein the printed circuitry comprises aflexible printed circuit.
 8. The storage device transporter of claim 1,further comprising a temperature sensor arranged to contact a storagedevice supported by the frame for measuring a temperature of the storagedevice.
 9. The storage device transporter of claim 8, further comprisinga clamping mechanism operatively associated with the frame, wherein theclamping mechanism is operable to move the conductive heating assemblyand the temperature sensor into contact with a storage device supportedby the frame.
 10. The storage device transporter of claim 8, wherein thetemperature sensor comprises a thermocouple.
 11. A test slot assemblycomprising: A.) a storage device transporter comprising: i.) a frameconfigured to receive and support a storage device, and ii.) aconductive heating assembly associated with the frame and arranged toheat a storage device supported by the frame by way of thermalconduction; and B.) a test slot comprising: i.) a test compartment forreceiving and supporting the storage device transporter.
 12. The testslot assembly of claim 11, wherein the conductive heating assemblycomprises: one or more electric heating elements, and contact terminalsin electrical communication with the one or more electric heatingelements, and wherein the test slot comprises: a connection interfacecircuit, and electrically conductive contacts in electricalcommunication with the connection interface circuit and arranged toengage the contact terminals of the conductive heating assembly when thestorage device transporter is disposed within the test compartment. 13.The test slot assembly of claim 12, wherein the one or more electricheating elements comprise one or more resistive heaters.
 14. The testslot assembly of claim 12, wherein the conductive heating assemblycomprises printed circuitry, wherein the printed circuitry comprises oneor more electrically conductive layers, and wherein the one or moreelectric heating elements are integrated in the one or more electricallyconductive layers.
 15. The test slot assembly of claim 12, wherein theelectrically conductive contacts are selected from the group consistingof spring contacts and pogo pins.
 16. The test slot assembly of claim11, wherein the conductive heating assembly comprises: one or moreelectric heating elements, and a first blind mate connector inelectrical communication with the one or more electric heating elements,and wherein the test slot comprises: a connection interface circuit, anda second blind mate connector in electrical communication with theconnection interface circuit and arranged to engage the first blind mateconnector when the storage device transporter is disposed within thetest compartment.
 17. The test slot assembly of claim 11, wherein thestorage device transporter further comprises a temperature sensorarranged to contact a storage device supported by the frame formeasuring a temperature of the storage device.
 18. The test slotassembly of claim 11, wherein the storage device transporter furthercomprises a clamping mechanism operatively associated with the frame,and wherein the clamping mechanism is operable to move the conductiveheating assembly into contact with a storage device supported by theframe.
 19. The test slot assembly of claim 18, wherein the clampingmechanism is operable to clamp the storage device transporter within thetest compartment.
 20. A storage device testing system comprising: A.) astorage device transporter comprising: i.) a frame configured to receiveand support a storage device, and ii.) a conductive heating assemblyassociated with the frame and arranged to heat a storage devicesupported by the frame by way of thermal conduction; and B.) a test slotcomprising: i.) a test compartment for receiving and supporting thestorage device transporter; ii.) a connection interface board; and C.)test electronics configured to communicate one or more test routines toa storage device disposed within the test compartment, wherein theconnection interface board is configured to provide electricalcommunication between the conductive heating assembly and the testelectronics when the storage device transporter is disposed within thetest compartment.
 21. The storage device testing system of claim 20,wherein the test electronics are configured to control a current flow tothe conductive heating assembly.
 22. The storage device testing systemof claim 20, wherein the storage device transporter further comprises atemperature sensor arranged to contact a storage device supported by theframe for measuring a temperature of the storage device
 23. The storagedevice testing system of claim 22, wherein the connection interfaceboard is configured to provide electrical communication between thetemperature sensor and the test electronics when the storage devicetransporter is disposed within the test compartment, and wherein thetest electronics are configured to control a current flow to theconductive heating assembly based, at least in part, on signals receivedfrom the temperature sensor.
 24. A method comprising: testingfunctionality of a storage device; and heating the storage device viathermal conduction during the testing.
 25. The method of claim 24,further comprising inserting a storage device transporter, supporting astorage device, into a test slot, wherein heating the storage devicecomprises heating the storage device by way of thermal conduction whilethe storage device transporter and the supported storage device aredisposed within the test slot.
 26. The method of claim 24, whereinheating the storage device by way of thermal conduction comprisesheating the storage device with a resistive heater.
 27. The method ofclaim 26, further comprising contacting the storage device with theresistive heater.
 28. The method of claim 27, wherein contacting thestorage device with the resistive heater comprises actuating a clampingmechanism to move the resistive heater into contact with the storagedevice.